SK-1350 GF Thermal Gap Filler(导热凝胶)
Blue / Two Part Silicone-based / Thermally Conductive Gap Filler
INTRODUCTION SK-1350 GF Thermal gap filler is a two part liquid silicone-based material, curing at room temperature once mixed. SK-1350 GF is a soft and compressible material designed to dissipate heat from electronic devices such as PCB modules by conducting it to a heat sink such as an aluminum housing.
Unlike cured thermal pad materials, SK-1350 GF thermal gap filler is supplied as a two-part liquid component kits. When the liquid components are thoroughly mixed either by weight or volume, the mixture cures to a soft elastomer. These elastomers cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. SK-1350 GF has long term performance stability during temperature cycling up to 200℃.
SK-1350 GF thermal gap filler is used for smartphones, portable computing devices, LED lighting modules, PCB modules, communication equipment and electric vehicle parts, provide a reliable cooling solution.
Two-part 1 : 1
Low interface stress
Optimized dispensing Thermal conductivity 3.5 W/m.K
Room temperature curing
Easy to rework
FEATURES
Portable electronics
LED lighting modules
SSD Automotive electronics
Telecommunications
ECU BMS
TYPICAL APPLICATIONS
TYPICAL PROPERTIES
Test Item Data Test Item Data
Composition Silicones Hardness 40 Shore OO
Appearance A : White / B : Blue Volume Resistivity ≥1.0*1012 Ω.cm
Mix Ratio by Weight A：B=1：1 Dielectric Constant 7.0 （@1 MHz）
Specific Gravity 3.0 g/cm3 Dielectric Strength ≥10 KV （@1mm）
Viscosity @ 25℃ cPs Use Temperature range -60 - 200℃
Thermal Conductivity 3.5 W/m.K Flammability Rating V-0
Thermal Resistance Min. （@50psi) ≤0.06 ℃ in2/W Low Volatility Content（D4-D20） ≤100 ppm
THERMAL RESISTANCE Units: ℃ in2/W
Compression 0.1mmT 0.2mmT 0.3mmT 0.5mmT 1.0mmT 1.5mmT 2.0mmT 3.0mmT 4.0mmT 5.0mmT
20 psi 0.08 0.15 0.22 0.31 0.40 0.50 0.59 0.78 0.97 1.15
50 psi 0.07 0.12 0.19 0.28 0.36 0.45 0.54 0.70 0.88 1.03
DEFLECTION VS.PRESSURE(after cure)
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