SK-1800 GF Thermal Gap Filler
Yellow / Two Part Silicone-based / Thermally Conductive Gap Filler
INTRODUCTION
SK-1800 GF Thermal gap filler is a two part liquid silicone-based material, curing at room temperature once mixed. SK-1800 GF is a soft and compressible material designed to dissipate heat from electronic devices such as PCB modules by conducting it to a heat sink such as an aluminum housing.
Unlike cured thermal pad materials, SK-1800 GF thermal gap filler is supplied as a two-part liquid component kits. When the liquid components are thoroughly mixed either by weight or volume, the mixture cures to a soft elastomer. These elastomers cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. SK-1800 GF has long term performance stability during temperature cycling up to 200℃.
SK-1800 GF thermal gap filler is used for smartphones, portable computing devices, LED lighting modules, PCB modules, communication equipment and electric vehicle parts, provide a reliable cooling solution.
FEATURES Two-part 1 : 1
Low interface stress
Optimized dispensing Thermal conductivity 1.8 W/m.K
Room temperature curing
Easy to rework
TYPICAL APPLICATIONS Portable electronics
LED lighting modules
SSD Automotive electronics
Telecommunications
ECU BMS
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