倒焊芯片。裸芯片封装技术之一，在LSI 芯片的电极区制作好金属凸点，然后把金属凸点与印刷基板上的电极区进行压焊连接。封装的占有面积基本上与芯片尺寸相同。是所有封装技术中体积最小、最薄的一种。但如果基板的热膨胀系数与LSI 芯片不同，就会在接合处产生反应，从而影响连接的可靠性。因此必须用树脂来加固LSI 芯片，并使用热膨胀系数基本相同的基板材料。
6、FP（flat package）
STM32L151CBT6
STM32F030C8T6
STM32F207VCT6
STM32F051C8T6
STM32L052K8U6TR
STM32F051C8T6
STM32P100R8SODTR
STM32P100R8S0DTR
STM32P10SODTR
STM32P10S0DTR
STM32F103R6H6
STM32L151R8H6
74VHC595MTCX
YDA174-QZE2
TJA1042T/CM
XC4VSX55-11FF1148I
XC4VSX55-10FF1148I
M25P64-VMF6TP
AT24C64D-SSHM-T
KMK7X000VM-B314
PIC18F25K80-I/SS
HCS300-I/SN
IRF7317TRPBF
CM108B
IRFB7537PBF
ATTINY45-20SU
LAN9514-JXZ
MCP3201-BI/SN
C2M0080120D
ATA6560-GAQW-N
ATMEGA328P-AU
ATTINY461A-SUR
HS-100B
IRFI4019H-117P
MCP2551T-I/SN
MIC5319-3.0YD5-TR
S25FL256SAGMFIG03
CY8CMBR3108-LQXIT
CYPD5126-40LQXIT
TPA3118D2DAPR
TPS65910A3A1RSLR
TCA9509DGKR
INA197AIDBVR
TPS51125RGER
TLV9062IDGKR
DRV8313RHHR
TPS65217CRSLR
UCC27282DRCR
SC667545VLU6
STM32F103VET6
TEF6686AHN/V205
MCIMX6Y2CVM08AB
LPC822M101JHI33E
74AVC8T245BQ
KSZ8863RLLI
KSZ8081MNXIA-TR
MCP9700AT-E/LT
PIC16F1508-I/SS
ATMEGA1284P-AU
ICE3PCS01G
IRFP4668PBF
