千住水溶性锡膏
MA(8)C1-T8G(无卤素锡膏)
1.Scope
This specification covers the solder paste,
ECO SOLDER PASTE MA(8)C1-T8G, using lead-free solder alloy, used
for wiring connection and so on, of electrical and electronic parts.
2.Standard
2.1 Chemical composition of solder alloy(Test method : STM-9-1)
Composition and impurities are prescribed as following tables.
Composition ( mass% )
Ag3.0 ± 0.1 /Cu0.50 ± 0.05/Sn
2.2 Melting temperature range and specific gravity of solder alloy(Reference value)
Melting temperature range ℃
Approx. 217 ~ 220
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