美国kester6502 助焊膏tsf6502的 免清洗型焊锡膏 详细描述：
Kester TSF-6592 is a No Clean Paste Flux designed as a Lead Free Solution for an array of Lead Free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any Lead Free soldering application that requires a very tacky flux.
高活性，低粘度，适用于免BGA ,PGA,CSP之封装植球制程。可于空气和氮气的回焊环境下进行焊接。高活性免洗制程。可润湿各种合金，包含镍，锡铅，有机护铜，化学镍金及钯。
