无线充电集成全桥四合一MOS管功率芯片找至为芯科技CJFB30H20
智能全桥四合一MOS方案
DFNWB5*6-8L
市面第一款智能全桥方案
集成度高，优化系统布局
DFN5*6封装，加强散热设计
四合一，适用于单线圈/多线圈方案
可根据客户要求封装不同参数芯片
DESCRIPTION:
The CJFB30H20 uses advanced trench technology and design
to provide excellent RDS(ON) with low gate charge. It can be used in a
wide variety of applications
FEATURES:
Full Bridge switch
Load switch
High density cell design for ultra low RDS(ON)
Fully characterized avalanche voltage and current
Good stability and uniformity with high EAS
Excellent package for good heat dissipation
Special process technology for high ESD capability
APPLICATIONS:
SMPS and general purpose applications
Hard switched and high frequency circuits
